XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.

XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.

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2 Inch Freestanding Si-GaN GaN(Gallium Nitride) Substrates And Wafers

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XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
City:xiamen
Province/State:fujian
Country/Region:china
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2 Inch Freestanding Si-GaN GaN(Gallium Nitride) Substrates And Wafers

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Brand Name :PAM-XIAMEN
Place of Origin :China
MOQ :1-10,000pcs
Price :By Case
Payment Terms :T/T
Supply Ability :10,000 wafers/month
Delivery Time :5-50 working days
Packaging Details :Packaged in a class 100 clean room environment, in single container, under a nitrogen atmosphere
Item :PAM-FS-GAN-50-SI
product name :SI-GaN GaN Substrates
Conduction Type :Semi-Insulating
Dimension :50.8 ±1 mm
Thickness :350 ±25 μm 430±25μm
other name :Gallium Nitride substrate
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2 Inch Freestanding Si-GaN GaN(Gallium Nitride) Substrates And Wafers

PAM-XIAMEN has established the manufacturing technology for freestanding (Gallium Nitride)GaN substrate wafer which is for UHB-LED and LD. Grown by hydride vapour phase epitaxy (HVPE) technology,Our GaN substrate has low defect density and less or free macro defect density.

PAM-XIAMEN offers full range of GaN and Related III-N Materials including GaN substrates of various orientations and electrical conductivity,crystallineGaN&AlN templates, and custom III-N epiwafers.

2inch Freestanding Si-GaN GaN Substrates

Item PAM-FS-GaN-50-SI
Dimension 50.8 ±1 mm
Thickness 350 ±25 μm 430±25μm
Orientation C plane (0001) off angle toward M-axis 0.35 ±0.15°
Orientation Flat (1-100) 0 ±0.5°, 16 ±1 mm
Secondary Orientation Flat (11-20) 0 ±3°, 8 ±1 mm
Conduction Type

Semi-Insulating

Resistivity (300K)

>106 Ω·cm

TTV ≤ 15 μm
BOW -20 μm ≤ BOW ≤ 20 μm
Surface Roughness:

Front side: Ra<0.2nm, epi-ready;

Back side: Fine Ground or polished.

Dislocation Density From 1 x 105 to 5 x 10 6cm -2(calculated by CL)*
Macro Defect Density < 2 cm-2
Useable Area > 90% (edge and macro defects exclusion)
Package each in single wafer container, under nitrogen atmosphere, packed in class 100 clean room

Application of GaN Substrate

Solid State Lighting:GaN devices are used as ultra high brightness light emitting diodes (LEDs), TVs, automobiles, and general lighting

DVD Storage: Blue laser diodes

Power Device: GaN devices are used as various components in high-power and high-frequency power electronics like cellular base stations, satellites, power amplifiers, and inverters/converters for electric vehicles (EV) and hybrid electric vehicles (HEV). GaN’s low sensitivity to ionizing radiation (like other group III nitrides) makes it a suitable material for spaceborne applications such as solar cell arrays for satellites and high-power, high-frequency devices for communication, weather, and surveillance satellites

Wireless Base Stations: RF power transistors

Wireless Broadband Access: high frequency MMICs,RF-Circuits MMICs

Pressure Sensors:MEMS

Heat Sensors: Pyro-electric detectors

Power Conditioning: Mixed signal GaN/Si Integration

Automotive Electronics: High temperature electronics

Power Transmission Lines: High voltage electronics

Frame Sensors: UV detectors

Solar Cells:GaN’s wide band gap covers the solar spectrum from 0.65 eV to 3.4 eV (which is practically the entire solar spectrum), making indium gallium nitride

(InGaN) alloys perfect for creating solar cell material. Because of this advantage, InGaN solar cells grown on GaN substrates are poised to become one of the most important new applications and growth market for GaN substrate wafers.

Ideal for HEMTs, FETs

GaN Schottky diode project: We accept custom spec of Schottky diodes fabricated on the HVPE-grown, free-standing gallium nitride (GaN) layers of n- and p-types.

Both contacts (ohmic and Schottky) were deposited on the top surface using Al/Ti and Pd/Ti/Au.

Zinc Blende crystal structure
Remarks Referens
Energy gaps, Eg 3.28 eV 0 K Bougrov et al. (2001)
Energy gaps, Eg 3.2 eV 300 K
Electron affinity 4.1 eV 300 K
Conduction band
Energy separation between Γ valley and X valleys EΓ 1.4 eV 300 K Bougrov et al. (2001)
Energy separation between Γ valley and L valleys EL 1.6 ÷ 1.9 eV 300 K
Effective conduction band density of states 1.2 x 1018 cm-3 300 K
Valence band
Energy of spin-orbital splitting Eso 0.02 eV 300 K
Effective valence band density of states 4.1 x 1019 cm-3 300 K

Band structure for Zinc Blende GaN

2 Inch Freestanding Si-GaN GaN(Gallium Nitride) Substrates And Wafers Band structure of zinc blende(cubic) GaN. Important minima of the conduction band and maxima of the valence band.
300K; Eg=3.2 eVeV; EX= 4.6 eV; EL= 4.8-5.1 eV; Eso = 0.02 eV
For details see Suzuki, Uenoyama & Yanase (1995) .


2 Inch Freestanding Si-GaN GaN(Gallium Nitride) Substrates And Wafers Brillouin zone of the face centered cubic lattice, the Bravais lattice of the diamond and zincblende structures.

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