XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.

XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.

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Undoped InAs Substrate , 2”, Prime Grade , Epi Ready -InAs Wafer Manufacturer

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XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
City:xiamen
Province/State:fujian
Country/Region:china
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Undoped InAs Substrate , 2”, Prime Grade , Epi Ready -InAs Wafer Manufacturer

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Brand Name :PAM-XIAMEN
Place of Origin :China
MOQ :1-10,000pcs
Payment Terms :T/T
Supply Ability :10,000 wafers/month
Delivery Time :5-50 working days
Packaging Details :Packaged in a class 100 clean room environment, in single container, under a nitrogen atmosphere
product name :Undoped InAs Substrate Wafer
Wafer Diamter :2 inch
Conduction Type :N Type
Grade :Prime Grade
Wafer Thickness :500±25um
keyword :high purity single crystal Indium arsenide Wafer
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Undoped InAs Substrate , 2”, Prime Grade , Epi Ready -InAs Wafer Manufacturer

PAM-XIAMEN manufactures high purity single crystal Indium arsenide Wafers for optoelectronics applications. Our standard wafer diameters range from 25.4 mm (1 inch) to 100 mm (6 inches) in size; wafers can be produced in various thicknesses and orientations with polished or unpolished sides and can include dopants. PAM-XIAMEN can produce wide range grades: prime grade, mechanical grade,test grade, dummy grade, technical grade, and optical grade. PAM-XIAMEN also offers materials to customer specifications by request, in addition to custom compositions for commercial and research applications and new proprietary technologies.

2" InAs Wafer Specification

Item Specifications
Dopant Undoped
Conduction Type N-type
Wafer Diameter 2"
Wafer Orientation (100)±0.5°
Wafer Thickness 500±25um
Primary Flat Length 16±2mm
Secondary Flat Length 8±1mm
Carrier Concentration 5x1016cm-3
Mobility ≥2x104cm2/V.s
EPD <5x104cm-2
TTV <10um
BOW <10um
WARP <12um
Laser marking upon request
Suface finish P/E, P/P
Epi ready yes
Package Single wafer container or cassette

What is the InAs Process?

InAs wafers must be prepared prior to device fabrication. To start, they must be completely cleaned to remove any damage that might have occurred during the slicing process. The wafers are then Chemically Mechanically Polished/Plaranrized (CMP) for the final material removal stage. This allows for the attainment of super-flat mirror-like surfaces with a remaining roughness on an atomic scale. After that is completed, the wafer is ready for fabrication.

Basic Parameters at 300 K of InAs Wafer?

Crystal structure Zinc Blende
Group of symmetry Td2-F43m
Number of atoms in 1 cm3 3.59·1022
de Broglie electron wavelength 400 A
Debye temperature 280 K
Density 5.68 g cm-3
Dielectric constant (static) 15.15
Dielectric constant (high frequency) 12.3
Effective electron mass 0.023mo
Effective hole masses mh 0.41mo
Effective hole masses mlp 0.026mo
Electron affinity 4.9 eV
Lattice constant 6.0583 A
Optical phonon energy 0.030 eV

Are You Looking for an InAs substrate?

PAM-XIAMEN is proud to offer indium phosphide substrate for all different kinds of projects. If you are looking for InAs wafers, send us enquiry today to learn more about how we can work with you to get you the InAs wafers you need for your next project. Our group team is looking forward to providing both quality products and excellent service for you!

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